DevConf.US 2024 Call for Proposals

Important dates

  • CfP opens: February 12th, 2024
  • CfP closes: April 22nd, 2024
  • CfP notifications: May 20th-24th, 2024
  • Schedule and registration: June 1st 2024
  • Event dates: August 14th-16th, 2024

Visa invitation letters
We can provide a visa invitation letter to accepted speakers and registered attendees. Please fill out the form to request a visa invitation letter.
If you need the visa invitation letter before our acceptance letters are sent out or before registration opens, specify the reason in the ‘Additional Information’ section of the form.

While developing your proposal, consider the following:

  • All material should be presented in English
  • You can submit more than one proposal
  • You can edit your proposal(s) after submission (until the CfP Closes)
  • Submissions don't need to include completed slides
  • Make sure the submission is relevant to the DevConf.US audience:

    1. Is the content original or the way the content is presented original? Avoid overview sessions. Focus on technical, community project-oriented content. Talks with a lot of audience interactions and demos are encouraged.
    2. If the session focuses on a product, is it about technical aspects? Avoid all marketing and sales presentations, product pitches are received poorly.
    3. Does the talk cover new/planned work and ideas or does it review previous work? New and upcoming work generally increases the chance of acceptance. We'd like to see emerging topics that might hit engineering in 1-2 years.
  • Before hitting enter, ask yourself:

    1. Does the content match the level of difficulty and the duration?
    2. If you were to attend your talk, would you feel excited?
    3. Why should people attend your talk instead of another session?
    4. What would the audience gain from your talk?

Check out our FAQ to learn more about session formats and frequently asked speaker questions.

Note: All speakers must be present at the conference in person to deliver accepted talks.