DIC Measurements for Achievement of Young's Modulus Values for High Temperature Applications of Refractories
2024-09-19 , Brussels Hall

Elastic properties of materials are essential for the description of the material behaviour due to external stresses. Young’s modulus values are of high importance for technical application with refractories. Precise determination of this material parameter is crucial for a reliable and cost effective construction and simulation of high temperature vessels and processes.
This study compares different methods for the determination of static and dynamic Young’s Modulus at low and high temperatures. For the acievement of static Young’s Modulus data usually stress strain curves of three point bending tests are used. Nevertheless the high stiffness of the testing samples often leads to compression of the testing device itself resulting in too high deformation values as well as less precise Young’s Modulus values. Due to the use of a stiff bending bar quantification of the bending device deformation is possible and therefore a modified and realistic achievement of the Young’s Modulus data is generated. Furthermore the deflection of testing bars was measured by means of digital image correlation (DIC). The applied DIC device ignores typical spring-back and setting effects, reveals a direct measurement of local strains on the sample surface and due to a stochastic pattern the deflection and area analysis is possible. High temperature results of this static measurements are compared and discussed to other methods such as the dynamic resonance frequency damping analysis (RFDA).