2019-09-04 –, Main
The Slim Bootloader was launched publicly in OSFC2018. Since then, it has attracted public interest and gaining momentum in adoption from the open-source community. The team at Intel continues to make improvements, enhancements & new features to Slim Bootloader over the year and this presentation will provide a summary of what has changed and the key learnings we’ve obtained. This session will also share on the future plans for Slim Bootloader and what’s to be expected.
Yah Wen is a Senior BIOS & Bootloader Lead Engineer from the Internet of Things Group (IoTG) in Intel Corporation. He has 15 years' experience in BIOS, UEFI & bootloader development mainly in computer mobile & desktop boards, industrial PXIe controllers as well as other embedded systems. He is from Penang, Malaysia.
The Slim Bootloader was launched publicly in OSFC2018. Since then, it has attracted public interest and gaining momentum in adoption from the open-source community. The team at Intel continues to make improvements, enhancements & new features to Slim Bootloader over the year and this presentation will provide a summary of what has changed and the key learnings we’ve obtained. This session will also share on the future plans for Slim Bootloader and what’s to be expected.